Download PDF by Von Hardenberg C.: Bare-hand human-computer interaction

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13 Typical burn-in probe marks. In general, the greater the distance between pads, the more skid there will be. The greatest distance is across the wafer from one side to the other. The outer pads therefore need to be the largest. Since all die on the wafer are usually the same, it forces large pads on all die. The bigger the wafer, the bigger the pads need to be. While the CTE mismatch applies to bumped wafers as well, the greater pitch usually allows for larger pads. The skid, if any, will then not be as much of a problem.

Cheng, S. Mahadevan, and R. Press, “Achieving high test quality with reduced pin count testing,” in Proceedings of Asian Test Symposium, 2005, pp. 312–317. [48] T. G. Foote, D. E. Hoffman, W. V. Huott, T. J. Koprowski, M. P. Kusko, and B. J. Robbins, “Testing the 500-MHz IBM S/390 Microprocessor,” IEEE Design & Test of Computers, vol. 15, no. 3, pp. 83–89, 1998. Introduction 23 [49] B. Koupal, T. Lee and B. pdf. [50] C. Pan and K. Cheng, “Pseudo-random testing and signature analysis for mixed-signal circuits,” Proceedings of International Conference on Computer Aided Design, 1995, pp.

57] W. R. Daasch, K. Cota, J. McNames, and R. Madge, “Neighbor selection for variance reduction in IDDQ and other parametric data,” in Proceedings of International Test Conference, 2001, pp. 1240–1249. [58] S. Sabade and D. M. H. Walker, “Improved wafer-level spatial analysis for IDDQ limit setting,” Proceedings of International Test Conference, 2001, pp. 82–91. [59] A. Keshavarzi, K. Roy, C. F. Hawkins, and V. De, “Multiple-parameter CMOS IC testing with increased sensitivity for IDDQ,” IEEE Transactions on VLSI Systems, vol.

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Bare-hand human-computer interaction by Von Hardenberg C.


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